Sensys 2026-sub

We are excited to announce the inaugural edition of the International Conference on Embedded Artificial Intelligence and Sensing Systems (SenSys).

The goal of this new conference is to offer a single, top-ranked, flagship event for the research communities formerly revolving around SenSys, IPSN, and IoTDI, as well as a focal point for other communities in related fields. The original three conferences, now merged into SenSys 2026, have driven innovation across multiple disciplines, including sensor networks, embedded systems, mobile computing, wireless communication, signal processing, data science, and AI-driven applications. Nevertheless, the continued and increasing relevance of intelligent sensing systems in academia and industry demands a unified, high-impact forum acting as a catalyzer for advancing research at the intersection of sensing systems and embedded artificial intelligence. The new conference, sponsored jointly by ACM and IEEE, addresses exactly this need. SenSys will provide a comprehensive platform where researchers and industry professionals from different areas can converge to present state-of-the-art research, exchange novel ideas, address key challenges, and ultimately shape the future of this continuously expanding and interdisciplinary field.